Regenerated the 3D model.

PCB_25x25mm_4Layers/rht_wired_sensor.kicad_pcb

@@ -31,6 +31,23 @@
   )
 
   (setup
+    (stackup
+      (layer "F.SilkS" (type "Top Silk Screen"))
+      (layer "F.Paste" (type "Top Solder Paste"))
+      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
+      (layer "F.Cu" (type "copper") (thickness 0.035))
+      (layer "dielectric 1" (type "core") (thickness 0.28) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
+      (layer "In1.Cu" (type "copper") (thickness 0.035))
+      (layer "dielectric 2" (type "prepreg") (thickness 0.28) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
+      (layer "In2.Cu" (type "copper") (thickness 0.035))
+      (layer "dielectric 3" (type "core") (thickness 0.28) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
+      (layer "B.Cu" (type "copper") (thickness 0.035))
+      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
+      (layer "B.Paste" (type "Bottom Solder Paste"))
+      (layer "B.SilkS" (type "Bottom Silk Screen"))
+      (copper_finish "None")
+      (dielectric_constraints no)
+    )
     (pad_to_mask_clearance 0)
     (aux_axis_origin 100 100)
     (grid_origin 100 100)

PCB_25x25mm_4Layers/rht_wired_sensor.kicad_pro

@@ -48,7 +48,13 @@
           "min_clearance": 0.25
         }
       },
-      "diff_pair_dimensions": [],
+      "diff_pair_dimensions": [
+        {
+          "gap": 0.0,
+          "via_gap": 0.0,
+          "width": 0.0
+        }
+      ],
       "drc_exclusions": [],
       "meta": {
         "filename": "board_design_settings.json",
@@ -113,7 +119,9 @@
         "min_via_diameter": 0.39999999999999997,
         "use_height_for_length_calcs": true
       },
-      "track_widths": [],
+      "track_widths": [
+        0.0
+      ],
       "via_dimensions": [
         {
           "diameter": 0.0,