Regenerated the 3D model.
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@ -31,6 +31,23 @@
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)
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(setup
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(stackup
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(layer "F.SilkS" (type "Top Silk Screen"))
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(layer "F.Paste" (type "Top Solder Paste"))
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(layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
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(layer "F.Cu" (type "copper") (thickness 0.035))
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(layer "dielectric 1" (type "core") (thickness 0.28) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
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(layer "In1.Cu" (type "copper") (thickness 0.035))
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(layer "dielectric 2" (type "prepreg") (thickness 0.28) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
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(layer "In2.Cu" (type "copper") (thickness 0.035))
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(layer "dielectric 3" (type "core") (thickness 0.28) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
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(layer "B.Cu" (type "copper") (thickness 0.035))
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(layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
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(layer "B.Paste" (type "Bottom Solder Paste"))
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(layer "B.SilkS" (type "Bottom Silk Screen"))
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(copper_finish "None")
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(dielectric_constraints no)
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)
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(pad_to_mask_clearance 0)
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(aux_axis_origin 100 100)
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(grid_origin 100 100)
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@ -48,7 +48,13 @@
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"min_clearance": 0.25
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}
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},
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"diff_pair_dimensions": [],
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"diff_pair_dimensions": [
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{
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"gap": 0.0,
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"via_gap": 0.0,
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"width": 0.0
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}
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],
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"drc_exclusions": [],
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"meta": {
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"filename": "board_design_settings.json",
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@ -113,7 +119,9 @@
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"min_via_diameter": 0.39999999999999997,
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"use_height_for_length_calcs": true
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},
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"track_widths": [],
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"track_widths": [
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0.0
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],
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"via_dimensions": [
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{
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"diameter": 0.0,
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