Moved some testpoints to the top layer and made them smaller. Minor layout change of the fuses (the components were too close to the pcb edge). Removed old iBOMs.

PCB/fp-info-cache

@@ -1,4 +1,4 @@
-17488978722639759
+17513526477473510
 Battery
 BatteryHolder_Bulgin_BX0036_1xC
 Bulgin Battery Holder, BX0036, Battery Type C (https://www.bulgin.com/products/pub/media/bulgin/data/Battery_holders.pdf)
@@ -46984,6 +46984,27 @@ PROGTEST_PROBE_EDGE_CONNECTOR
 36
 36
 HD_Connectors
+PROGTEST_TESTER_EDGE_SOCKET
+
+
+0
+36
+36
+HD_Connectors
+PinHeader_2x07_P1.27mm_Vertical_SMD
+surface-mounted straight pin header, 2x07, 1.27mm pitch, double rows
+Surface mounted pin header SMD 2x07 1.27mm double row
+0
+14
+14
+HD_Connectors
+PinSocket_1x05_P2.54mm_Horizontal
+Through hole angled socket strip, 1x05, 2.54mm pitch, 8.51mm socket length, single row (from Kicad 4.0.7), script generated
+Through hole angled socket strip THT 1x05 2.54mm single row
+0
+5
+5
+HD_Connectors
 RPi_Connector
 
 
@@ -47193,6 +47214,41 @@ lga land grid array
 0
 12
 12
+HD_Logos
+OSHW-Logo2_7.3x6mm_SilkScreen
+Open Source Hardware Symbol
+Logo Symbol OSHW
+0
+0
+0
+HD_Logos
+OSHW-Logo2_9.8x8mm_SilkScreen
+Open Source Hardware Symbol
+Logo Symbol OSHW
+0
+0
+0
+HD_Logos
+OSHW-Logo_5.7x6mm_SilkScreen
+Open Source Hardware Logo
+Logo OSHW
+0
+0
+0
+HD_Logos
+OSHW-Logo_7.5x8mm_SilkScreen
+Open Source Hardware Logo
+Logo OSHW
+0
+0
+0
+HD_Logos
+OSHW-Logo_11.4x12mm_SilkScreen
+Open Source Hardware Logo
+Logo OSHW
+0
+0
+0
 HD_Other
 0900FM15D0039
 
@@ -47264,6 +47320,13 @@ MLPF-WB55-01E3
 6
 6
 HD_Other
+MODULE_STLINK-V3MODS
+
+
+0
+32
+32
+HD_Other
 Meander_PCB_Antenna_2.4GHz
 
 
@@ -47445,6 +47508,13 @@ SOIC SO
 0
 8
 8
+HD_SO
+SOT-223-3(TAB-pin-2)
+module CMS SOT223 4 pins
+CMS SOT
+0
+4
+3
 HD_SON
 Texas_VSON8
 
@@ -52087,6 +52157,13 @@ RN2483A
 47
 47
 MRS_Connectors
+5-103361-1
+
+
+0
+3
+3
+MRS_Connectors
 A2501WR-2P1
 
 
@@ -52993,6 +53070,13 @@ MRS_Mechanical
 Garmin_Mounting_holes
 
 
+0
+4
+1
+MRS_Mechanical
+Jetson_Mounting_Holes
+
+
 0
 4
 1
@@ -53329,6 +53413,13 @@ MRS_Passives
 L_SRR1208
 
 
+0
+2
+2
+MRS_Passives
+L_SRU1038
+
+
 0
 2
 2
@@ -53543,6 +53634,13 @@ DIGI XBEE AND XBEE-PRO RF MODULES (LONG PADS)
 20
 20
 MRS_SO
+Diodes_SO-8EP
+8-Lead Plastic SO, Exposed Die Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf)
+SO exposed pad
+0
+9
+9
+MRS_SO
 PowerPAK_SO-8_Single
 PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf)
 PowerPAK SO-8 Single
@@ -53571,6 +53669,13 @@ TSSOP-16
 16
 16
 MRS_SO
+TSSOP-20_4.4x6.5mm_P0.65mm
+20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)
+SSOP 0.65
+0
+20
+20
+MRS_SO
 Texas_HSOP-8-1EP_3.9x4.9mm_P1.27mm_ThermalVias
 Texas Instruments HSOP 9, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf)
 HSOP 1.27